If you require the NSN part BC419, manufactured by Texas Instruments Incorporated having CAGE Code 01295 and categorized under FSC 5962 Microcircuits Electronic under NSN 5962007624792, then look no further than NSN Gamut. Our company, which is owned and managed by ASAP Semiconductor, a distributor in the aerospace and defense industry, has an inventory of over two billion new and obsolete NSN parts, including part BC419 Microcircuit Memory and many more.
At NSN Gamut, we have a strict policy of not sourcing from China, ensuring that all parts you buy from us are completely traceable or sourced directly from reputable manufacturers like Texas Instruments Incorporated. Obtain a quote now for BC419. In any case if you don't find your required part submit our straight RFQ and get your part in on time.
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We offer a vast range of NSN 5962007624792 parts, including BC419, with quick lead times and competitive prices. NSN Gamut has a large selection of in-demand parts from manufacturers such as Texas Instruments Incorporated and others. To speak with a dedicated account manager, just submit an RFQ for BC419 with your basic details like your company name parts quantity required, and get your quote in 15 minutes or less.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-00-762-4792 Item Description: Microcircuit Memory | 5962 | 007624792 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | U | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Bc419 | C | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.140 INCHES MINIMUM AND 0.265 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.040 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 450.0 MILLIWATTS |
AFJQ | STORAGE TEMP RANGE | -65.0/+200.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS |
CQSJ | INCLOSURE MATERIAL | GLASS AND METAL |
CQWX | OUTPUT LOGIC FORM | CURRENT-MODE LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 2 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.2 VOLTS MINIMUM POWER SOURCE AND 5.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | DIODE MATRIX |
TEST | TEST DATA DOCUMENT | 06481-970049 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
TTQY | TERMINAL TYPE AND QUANTITY | 10 FLAT LEADS |
AFGA | OPERATING TEMP RANGE | -65.0/+175.0 DEG CELSIUS |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-91 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
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