NSN Part 058-004692-002 by Other - RFQ Form
Part number 058-004692-002 and described as Microcircuit Memory, manufactured by Other is in stock of NSN Gamut. We would like to invite you to kickstart the purchasing process for NSN part 058-004692-002 by filling out the form below. By providing us with details such as your company name and target price, we can offer you a personalized quote.
As a result of our extensive purchasing capabilities, we are able to offer competitive pricing and fast lead times on items sourced from various leading global manufacturers, including Other. As a result of our extensive purchasing capabilities, we are able to offer competitive pricing and fast lead times on items sourced from various leading global manufacturers, including Other. We are an AS9120B, ISO 9001:2015, and FAA AC 0056B certified and accredited organization and make sure you get quality NSN part 058-004692-002. Take the first step today towards acquiring the part 5962012996398 058-004692-002 and other NSN components you require, and experience how we can be your strategic sourcing partner.
Specifications
Description
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NSN Information for Part Number 058-004692-002 with NSN 5962-01-299-6398, 5962012996398
Characteristics Data of NSN 5962-01-299-6398, 5962012996398
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.054 INCHES MINIMUM AND 0.088 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 788.0 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND W/ENABLE AND BURN IN AND PROGRAMMABLE AND ERASABLE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
| CZER | MEMORY DEVICE TYPE | ROM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS" |
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.054 INCHES MINIMUM AND 0.088 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 788.0 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND W/ENABLE AND BURN IN AND PROGRAMMABLE AND ERASABLE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
| CZER | MEMORY DEVICE TYPE | ROM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS" |