If you require the NSN part 333945-1, manufactured by Bae Systems Information And Electronic Systems Integration Inc having CAGE Code 80249 and categorized under FSC 5962 Microcircuits Electronic under NSN 5962014128367, then look no further than NSN Gamut. Our company, which is owned and managed by ASAP Semiconductor, a distributor in the aerospace and defense industry, has an inventory of over two billion new and obsolete NSN parts, including part 333945-1 Microcircuit Set and many more.
At NSN Gamut, we have a strict policy of not sourcing from China, ensuring that all parts you buy from us are completely traceable or sourced directly from reputable manufacturers like Bae Systems Information And Electronic Systems Integration Inc. Obtain a quote now for 333945-1. In any case if you don't find your required part submit our straight RFQ and get your part in on time.
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We offer a vast range of NSN 5962014128367 parts, including 333945-1, with quick lead times and competitive prices. NSN Gamut has a large selection of in-demand parts from manufacturers such as Bae Systems Information And Electronic Systems Integration Inc and others. To speak with a dedicated account manager, just submit an RFQ for 333945-1 with your basic details like your company name parts quantity required, and get your quote in 15 minutes or less.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-412-8367 Item Description: Microcircuit Set | 5962 | 014128367 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
333945-1 | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
CRHL | (NON-CORE DATA) BIT QUANTITY | 4096 |
CZER | MEMORY DEVICE TYPE | PROM |
TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
CSWJ | (NON-CORE DATA) WORD QUANTITY | 512 |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS ALL MEMORY |
ASDD | COMPONENT FUNCTION RELATIONSHIP | MATCHED |
CQSJ | INCLOSURE MATERIAL | CERAMIC ALL MEMORY |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE ALL MEMORY |
CSSL | DESIGN FUNCTION AND QUANTITY | 2 MEMORY, PROGRAMMABLE READ ONLY |
CSSL | DESIGN FUNCTION AND QUANTITY | 2 MEMORY, PROGRAMMABLE READ ONLY ALL MEMORY |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER ERR-100 ERR-100 |
CZEM | MICROCIRCUIT DEVICE TYPE AND QUANTITY | 2 MEMORY |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE ERR-100 |
CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM ACCESS ALL MEMORY |
CZER | MEMORY DEVICE TYPE | PROM ERR-100 ERR-100 |
TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT ALL MEMORY |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | PROGRAMMED 512 X 8 PROM SET |
CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM ACCESS |
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